Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company's products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. The company was founded in 1998 and is headquartered in Kaohsiung, Taiwan.
Stock data | 2024 | Change |
---|---|---|
Price | $0.4673470013177653 | N/A |
Market Cap | $81.94M | N/A |
Shares Outstanding | 175.34M | N/A |
Employees | 475.00 | N/A |