Malaysian Pacific Industries Berhad, an investment holding company, engages in the manufacture, assemble, test, and sale of integrated circuits, semiconductor devices, electronic components, and lead frames in Asia, the United States, and Europe. It also provides turnkey solutions for leaded and leadless semiconductor packaging and test services; and outsourced semiconductor packaging and testing solutions. Its products are used in the industrial, automotive, and telecommunications sectors. The company was formerly known as Federal Paper Products Sdn Berhad and changed its name to Malaysian Pacific Industries Berhad in May 1983. Malaysian Pacific Industries Berhad was incorporated in 1962 and is based in Ipoh, Malaysia. Malaysian Pacific Industries Berhad is a subsidiary of Hong Leong Manufacturing Group Sdn Bhd.
Stock data | 2023 | Change |
---|---|---|
Price | $6.21 | N/A |
Market Cap | $1.23B | N/A |
Shares Outstanding | 198.86M | 0.15% |
Employees | 7.62K | N/A |
Shareholder Equity | 2.36B | 1.66% |
Valuation | 2023 | Change |
---|---|---|
P/E Ratio | 20.13 | N/A |
P/S Ratio | 2.61 | N/A |
P/B Ratio | 0.52 | N/A |
Growth | 2023 | Change |
---|---|---|
Return on Equity | 0.0106 | N/A |
Earnings | 2023 | Change |
---|---|---|
Revenue | $472.17M | N/A |
Earnings | $24.97M | N/A |
EPS | 0.3084 | N/A |
Earnings Yield | 0.0497 | N/A |
Gross Margin | 0.1132 | N/A |
Operating Margin | 0.0524 | N/A |
Net income margin | 0.0529 | N/A |
Financial Strength | 2023 | Change |
---|---|---|
Total Assets | $695.56M | N/A |
Total Debt | $63.88M | N/A |
Cash on Hand | $243.18M | N/A |
Debt to Equity | 0.0638 | -19.57% |
Cash to Debt | $3.81 | -13.35% |
Current Ratio | $2.80 | 8.35% |