Malaysian Pacific Industries Berhad (3867) Stock Overview

Malaysian Pacific Industries Berhad, an investment holding company, engages in the manufacture, assemble, test, and sale of integrated circuits, semiconductor devices, electronic components, and lead frames in Asia, the United States, and Europe. It also provides turnkey solutions for leaded and leadless semiconductor packaging and test services; and outsourced semiconductor packaging and testing solutions. Its products are used in the industrial, automotive, and telecommunications sectors. The company was formerly known as Federal Paper Products Sdn Berhad and changed its name to Malaysian Pacific Industries Berhad in May 1983. Malaysian Pacific Industries Berhad was incorporated in 1962 and is based in Ipoh, Malaysia. Malaysian Pacific Industries Berhad is a subsidiary of Hong Leong Manufacturing Group Sdn Bhd.

3867 Stock Information

Symbol

3867

Address

Jalan Lapangan TerbangIpoh, 31350Malaysia

Founded

Trading hours

Website

https://www.mpind.my

Country

🇲🇾 Malaysia

Phone Number

Malaysian Pacific Industries Berhad (3867) Price Chart

Malaysian Pacific Industries Berhad Overview: Key Details and Summary

Stock data	2023	Change
Price	$6.36	N/A
Market Cap	$1.27B	N/A
Shares Outstanding	198.86M	0.15%
Employees	7.62K	N/A
Shareholder Equity	2.36B	1.66%

Valuation	2023	Change
P/E Ratio	20.63	N/A
P/S Ratio	2.63	N/A
P/B Ratio	0.54	N/A

Growth	2023	Change
Return on Equity	0.0108	N/A

Earnings	2023	Change
Revenue	$481.79M	N/A
Earnings	$25.48M	N/A
EPS	0.3084	N/A
Earnings Yield	0.0485	N/A
Gross Margin	0.1132	N/A
Operating Margin	0.0524	N/A
Net income margin	0.0529	N/A

Financial Strength	2023	Change
Total Assets	$709.73M	N/A
Total Debt	$65.18M	N/A
Cash on Hand	$248.14M	N/A
Debt to Equity	0.0651	-19.57%
Cash to Debt	$3.81	-13.35%
Current Ratio	$2.80	8.35%