3s Silicon Tech. (5297) Stock Overview

3s Silicon Tech., Inc. provides die bonding in discrete power devices in Taiwan and internationally. It offers clip die bonder for power devices, such as clip die bonder, clip attach, and pick and place; snap ovens, including normal snap oven, snap oven with vacuum reflow process, formic acid reflow oven, power module assembly automation solution, and flux eutectic reflow oven; customized equipment comprising power device assembly automation solution and power discrete assembly automation solutions; and open lab platform, such as product and fabrication process verification. The company was founded in 1998 and is based in Hsinchu, Taiwan.